This challenge is no longer accepting new submissions.
Students developing applications which create intelligence from manufacturing data
Department of Defense
Type of Challenge: Software and apps
Partner Agencies | Non-federal: Office of the Secretary of Defense (OSD) Defense-wide Manufacturing Science and Technology (DMS&T) and executed by the U.S. Army Benét Labs, AMT-The Association For Manufacturing Technology, the National Center for Defense Manufacturing and Machining (NCDMM), and the MTConnect Institute, in partnership with SME and the National Tooling and Machining Association (NTMA)
Submission Start: 06/09/2015 12:30 PM ET
Submission End: 07/15/2016 12:00 PM ET
This challenge is externally hosted.
You can view the challenge details here: http://mtconnect-apps.devpost.com/
UPDATE: Please upload all submissions through our new challenge site here: MTConnect-Apps.devpost.com
The submission deadline for this competition has been EXTENDED to July 15, 2016. Winners will be announced by September 17, 2016. Finalists will be invited to Chicago to attend IMTS-The International Manufacturing Technology Show, one of the largest manufacturing trade shows in the world, taking place September 12-17, 2016
Attention all college and university students! We are standing at the intersection of big data and industrial manufacturing, and we need you to help us maximize connected technologies to revolutionize the manufacturing industry. Although the Industrial Internet of Things has been around for some time now, right now there is a new wave of innovation in how these industrial machines communicate. Every piece on the factory floor is a potential source of valuable data that could be used to improve the entire manufacturing industry, from the products themselves to how work gets done.
So we’re asking you to develop super innovative and advanced manufacturing intelligence application solutions, which are both innovative and deployable, using data acquired through the MTConnect standard. MTConnect is an open, XML- and HTTP-based communications standard that acts as the enabler for the Internet of Things for manufacturing by fostering improved connectivity and interoperability between manufacturing equipment and devices. Within the challenge itself, there are two separate competitions, and you can choose to participate in one or both.
#1— Idea Creation: Read more about the Ideation Challenge here.
#2— Applications: Using either an independent idea/solution, or your solution from the Ideation Challenge (should you chose to complete both challenges), you must create an innovative and effective application of your solution. Your submission must include a written summary of the application, a video of the application in action, and a thumbnail image.
Please see the Rules tab for a comprehensive run down of the challenge rules and requirements. For more information, check out the Discussion tab here and our resources on MTConnect.org. And, if you have any other questions, don’t hesitate to reach out on Facebook or Twitter. Good luck!
Cash Prize Amount: $22,500
RulesPlease refer to the attached document (updated on 6 MAY 2016 to clarify that recently graduated students are permitted to participate in this challenge): MTConnect Challenge Application Development Rules 6MAY2016 In addition to being available within our challenge discussion forum, a list of frequently asked questions can be viewed here: MTConnect Student Challenge – Website – FAQ – v2
How To EnterSubmission Requirements
Submissions to MTConnect Student Challenge:
Applications shall include a written summary of the application describing the benefits that can be derived from the application, a video of the application in action, and a thumbnail image representing the application. It is not necessary to submit the actual application software or code. However, the applicant must demonstrate the actual application directly to the judges in Rounds 2 and 3 of the judging process. The format for the written summary is provided below. The submission may also include supporting materials that demonstrate the capabilities of the application and/or the benefits that may be derived from the application. These supporting materials may be in the form of presentations, story boards, video, flash, or any other electronic format generally available to the public. Materials in formats that require specialized viewers or the installation of additional software to allow the judges to view the materials will not be accepted. The total submission may not exceed 35 MB (megabytes) in size. Please DO NOT submit source code or executable files. Submissions should only include items listed in the requirements. The descriptions, videos, and graphics submitted may be made public. The applicant must define how MTConnect and MTConnect data is used by the application solution submitted. In Rounds 2 and 3 of the judging, the application must effectively demonstrate the use of MTConnect and MTConnect data. It is also encouraged that submissions identify extensions that may be required to the MTConnect Standard to more fully implement the solutions identified in the proposal.